| Base material |
Substrate laminate |
Provides mechanical support and electrical insulation between conductive layers. |
Common rigid-board material is glass-reinforced epoxy laminate, often specified as FR-4. Flexible circuits commonly use polyimide. |
Consider operating temperature, mechanical requirements, dielectric properties, and the board’s intended environment. |
| Conductive layer |
Copper foil |
Forms the conductive paths and copper areas used to connect electrical features. |
Present on one or both sides of a single-sided or double-sided board, and in multiple layers of a multilayer board. |
Confirm the required layer count, copper thickness, current capacity, and manufacturing tolerances. |
| Circuit routing |
Traces |
Carry electrical signals or power between component pads, vias, and other copper features. |
Trace width and spacing depend on electrical, thermal, and manufacturing requirements. |
Review current, voltage, signal speed, impedance needs, and the available routing space. |
| Circuit routing |
Planes and copper pours |
Provide larger conductive areas, commonly for ground or power distribution, and can support heat spreading. |
May be continuous or divided into separate regions; connections are defined by the circuit layout. |
Check grounding strategy, return paths, power distribution, and clearances from other nets. |
| Layer connection |
Vias |
Connect conductive features between different layers of a multilayer board. |
Common types include through vias, blind vias, and buried vias; their construction and cost vary. |
Choose via type and dimensions to suit layer connections, routing density, reliability, and production capability. |
| Component interface |
Component pads |
Provide conductive landing areas for mounting and electrically connecting component leads or terminals. |
Pad geometry varies with the component package and assembly method, such as surface-mount or through-hole mounting. |
Use package-specific land patterns and check soldering clearances and assembly tolerances. |
| Surface protection |
Solder mask |
Insulates and protects most exposed copper while leaving selected areas available for soldering. |
Usually applied as a colored coating; openings expose pads and other designated copper features. |
Check mask openings, spacing, and compatibility with the intended assembly process. |
| Identification |
Silkscreen legend |
Displays component references, polarity marks, labels, and other assembly or service information. |
Printed on the board surface where space and design rules allow. |
Keep text legible and avoid placing markings over solderable pads or other critical areas. |
| Electrical component |
Resistors |
Limit current, divide voltage, set bias conditions, or provide termination in a circuit. |
Specified by resistance, tolerance, power rating, and package or mounting style. |
Check resistance value, power dissipation, tolerance, temperature behavior, and footprint. |
| Electrical component |
Capacitors |
Store and release electrical energy; commonly used for decoupling, filtering, and timing. |
Specified by capacitance, voltage rating, dielectric type, tolerance, and package. |
Verify capacitance under operating conditions, voltage margin, frequency behavior, and placement needs. |
| Electrical component |
Integrated circuits |
Perform functions such as processing, control, amplification, or power management. |
Available in packages with different pin counts, pitches, thermal characteristics, and assembly requirements. |
Check package footprint, pin mapping, power requirements, thermal needs, and design documentation. |
| Electrical component |
Connectors |
Provide electrical and, where applicable, mechanical connections to cables, other boards, or external devices. |
May use through-hole or surface-mount terminals and vary in pitch, pin count, and orientation. |
Confirm mating compatibility, current rating, retention, pin assignment, and board-edge clearance. |
| Assembly material |
Solder joints |
Create electrical and mechanical connections between component terminals and PCB pads. |
Formed during assembly using a soldering process appropriate to the component and board design. |
Consider pad design, component termination, thermal profile, and inspection requirements. |